Patent Assignment
Reel/Frame 068907/0418
Assignment of Assignor's Interest
Recorded: 2024-10-16
Pages: 4
Assignors
LIN, HSIAO-CHIANG
Executed: 2024-09-19
NOMURA, YOSHIHIRO
Executed: 2024-09-19
HUANG, CHAO WEN
Executed: 2024-09-19
Assignee
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
NO. 18, LI-HSIN RD. 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Manufacturing Method of Semiconductor Structure
Application:
18/909,876 →