Assignment of Assignor's Interest

Recorded: 2024-11-11 Pages: 4

Assignors

ONO, KEISHI

Executed: 2024-04-09

SUNOHARA, SEIJI

Executed: 2024-06-06

HIRAYAMA, YUYA

Executed: 2024-06-06

Assignee

RESONAC CORPORATION

9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN

Covered Property (1)

Photosensitive Resin Composition, Photosensitive Element, and Method for Producing Wiring Board

Application: 17/913,016 →

Publication: US 2023/0145264

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.