Patent Assignment
Reel/Frame 069226/0034
Assignment of Assignor's Interest
Recorded: 2024-11-12
Pages: 6
Assignors
IMAZU, YUKI
Executed: 2023-11-10
MITSUKURA, KAZUYUKI
Executed: 2023-11-13
TOBA, MASAYA
Executed: 2023-12-11
AOKI, YU
Executed: 2023-11-10
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Property
(1)
Method for Selecting Photosensitive Resin Composition, Method for Producing Patterned Cured Film, Cured Film, Semiconductor Device, and Method for Producing Semiconductor Device
Application:
18/560,234 →
Publication:
US 2024/0361697
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.