Patent Assignment
Reel/Frame 069422/0062
Assignment of Assignor's Interest
Recorded: 2024-11-27
Pages: 3
Assignor
HABA, BELGACEM
Executed: 2024-05-21
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Embedded Cooling Assemblies for Advanced Device Packaging and Methods of Manufacturing the Same
Application:
18/952,911 →
Publication:
US 2025/0239504
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.