IP Library › Assignment 069830/0791
Patent Assignment
Reel/Frame 069830/0791

Assignment of Assignor's Interest

Recorded: 2025-01-13 Pages: 4
Assignors
BSP CO., LTD.
Executed: 2025-01-08
JOONGWOO M-TECH CO., LTD.
Executed: 2025-01-08
Assignee
JOONGWOO M-TECH CO., LTD.
10, HAEBONG-RO 273 BEON-GIL , DANWON-GU, ANSAN-SI, GYEONGGI-DO, 15420, KOREA, REPUBLIC OF
Covered Properties (2)
Through-Glass via Hole Formation Method
Application: 17/000,381 →
Publication: US 2021/0122673
Method of Manufacturing Flexible Oled Module
Application: 17/068,837 →
Publication: US 2021/0143372
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 24, 2020
From: PARK, HONG JIN; PARK, SUNG SOO
To: BSP CO., LTD.; JOONGWOO M-TECH CO., LTD.
Reel/Frame 053569/0932 →
Assignment of Assignor's Interest Oct 13, 2020
From: PARK, HONG JIN; PARK, SUNG SOO
To: BSP CO., LTD.; JOONGWOO M-TECH CO., LTD.
Reel/Frame 054032/0553 →
Assignment of Assignor's Interest Apr 15, 2025
From: JOONGWOO M-TECH CO.,LTD.
To: JWMT INC.
Reel/Frame 070837/0222 →