Method of manufacturing flexible OLED module
View Patent ↗A method of manufacturing a flexible OLED module includes: forming a polymer layer on one surface of a base substrate; forming a thin glass sheet on one surface of the polymer layer; forming multiple OLED elements on one surface of the thin glass sheet; forming a protective layer on one surface of the thin glass sheet to cover the OLED elements; separating the base substrate and the polymer layer from each other through separation of the sacrificial layer by laser lift-off (LLO); and cutting the thin glass sheet and the protective layer to provide multiple unit OLED modules each including the OLED element.
1. A method of manufacturing a flexible OLED module, comprising:
a polymer layer formation step in which a polymer layer is formed on one surface of a base substrate;
a glass sheet formation step in which a glass sheet is formed on one surface of the polymer layer;
an OLED element formation step in which multiple OLED elements are formed on one surface of the glass sheet;
a protective layer formation step in which a protective layer is formed on one surface of the glass sheet to cover the OLED elements;
a separation step in which the base substrate is separated from the polymer layer by irradiating a boundary between the base substrate and the polymer layer with laser beams; and
a singulation step in which the glass sheet and the protective layer are cut to provide multiple unit OLED modules each comprising the OLED element,
wherein, in the polymer layer formation step, the polymer layer is formed in a region excluding a hole region corresponding to a hole for an electronic device to be assembled to the unit OLED modules.
2. The method according to claim 1 , wherein, in the polymer layer formation step, the polymer layer is formed in a region excluding a cutting-scheduled line along which cutting will be performed in the singulation step.
3. A method of manufacturing a flexible OLED module, comprising:
a polymer layer formation step in which a polymer layer is formed on one surface of a base substrate;
a glass sheet formation step in which a glass sheet is formed on one surface of the polymer layer;
an OLED element formation step in which multiple OLED elements are formed on one surface of the glass sheet;
a protective layer formation step in which a protective layer is formed on one surface of the glass sheet to cover the OLED elements;
a separation step in which the base substrate is separated from the polymer layer by irradiating a boundary between the base substrate and the polymer layer with laser beams; and
a singulation step in which the glass sheet and the protective layer are cut to provide multiple unit OLED modules each comprising the OLED element; and
an anti-etching layer formation step in which an anti-etching layer is formed on one surface of the protective layer, after the protective layer formation step,
wherein the singulation step comprises:
a deformation line generation step in which a glass deformation line is generated on the glass sheet by irradiating a cutting-scheduled line on the glass sheet with an intensity of laser beams not exceeding an ablation threshold of the glass sheet; and
an etching step in which the glass sheet and the protective layer are removed along the glass deformation line by removing the glass deformation line through etching with an etchant while allowing the protective layer exposed through the removed glass deformation line to be removed through etching with the etchant.
4. The method according to claim 3 , wherein, in the deformation line generation step, a phase of the glass deformation line is changed by irradiating the cutting-scheduled line with the laser beams from one surface of the glass sheet to the other surface thereof while focusing the laser beams at a single focus on the glass sheet.
5. The method according to claim 3 , wherein, in the deformation line generation step, a phase of the glass deformation line is changed by irradiating the cutting-scheduled line with the laser beams from one surface of the glass sheet to the other surface thereof while consecutively moving a focus of the laser beams.
6. The method according to claim 1 , wherein the glass sheet has a thickness of greater than 0 μm to 100 μm.
7. The method according to claim 1 , further comprising:
a sacrificial layer formation step in which a sacrificial layer is formed on one surface of the base substrate such that the polymer layer is formed on one surface of the sacrificial layer, before the polymer layer formation step,
wherein, in the separation step, the base substrate is separated from the polymer layer through separation of the sacrificial layer by laser lift-off (LLO).