Patent Assignment
Reel/Frame 069924/0708
Assignment of Assignor's Interest
Recorded: 2025-01-16
Pages: 6
Assignors
MIN, KYUNGDEUK
Executed: 2025-01-12
LEE, SINYEOP
Executed: 2025-01-08
KANG, TAEGYU
Executed: 2025-01-08
HWANG, JAESEON
Executed: 2025-01-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus for Soldering Electronic Devices
Application:
19/020,525 →
Publication:
US 2025/0239563