Apparatus for soldering electronic devices
An apparatus may include a base plate configured to support a package substrate, semiconductor chips on the package substrate in rows and columns; a lamp heater configured to irradiate light to the semiconductor chips to mount the semiconductor chips on the package substrate; and a pressurization mask including a transparent plate between the base plate and the lamp heater. The transparent plate includes a first surface facing the base plate and a second surface opposite to the first surface, light absorbing patterns on transmission regions of the first surface, such that the plurality of light absorbing patterns at least partially overlap with corresponding semiconductor chips of the plurality of semiconductor chips in the vertical direction, and a light reflecting pattern on a reflection region of the second surface, wherein the reflection region is not overlapped with the transmission regions in the vertical direction.
1 . An apparatus for soldering electronic devices, the apparatus comprising:
a base plate configured to support a package substrate, wherein a plurality of semiconductor chips are on the package substrate in a plurality of rows and a plurality of columns;
a lamp heater configured to irradiate light and emit radiation heat toward the plurality of semiconductor chips in a vertical direction, to mount the plurality of semiconductor chips on the package substrate;
a pressurization mask including a transparent plate between the base plate and the lamp heater, wherein the transparent plate includes
a first surface facing the base plate and a second surface opposite to the first surface,
a plurality of light absorbing patterns on a plurality of transmission regions of the first surface of the transparent plate, such that the plurality of light absorbing patterns at least partially overlap with corresponding semiconductor chips of the plurality of semiconductor chips in the vertical direction, the second surface of the transparent plate being free of the plurality of light absorbing patterns, and
a light reflecting pattern on a reflection region of the second surface of the transparent plate, wherein the reflection region is not overlapped with the plurality of transmission regions in the vertical direction; and
a mask holder enabling the pressurization mask to move in the vertical direction and press the corresponding semiconductor chips by contacting the plurality of light absorbing patterns with the corresponding semiconductor chips.
2 . The apparatus of claim 1 , wherein the lamp heater includes a xenon (Xe) lamp configured to irradiate a pulsed light.
3 . The apparatus of claim 1 , further comprising:
a supporting member including a mask frame and a plurality of horizontal ribs,
wherein the mask frame is configured to support a plurality of outer portions of the transparent plate such that the pressurization mask is parallel with the base plate, and
the plurality of horizontal ribs each extend from the mask frame in at least one of a first direction or a second direction, the second direction perpendicular to the first direction.
4 . The apparatus of claim 1 , wherein the first surface of the transparent plate is free of a light reflecting pattern.
5 . The apparatus of claim 1 , wherein
the transparent plate has a first thickness in the vertical direction, each of the light absorbing patterns has a second thickness in the vertical direction, and the light reflecting pattern has a third thickness in the vertical direction, and
each of the second thickness and the third thickness is smaller than the first thickness.
6 . The apparatus of claim 5 , wherein the second thickness and the third thickness are each within a range of 10 μm to 100 μm, and the first thickness is within a range of 3 mm to 10 mm.
7 . The apparatus of claim 1 , wherein the transparent plate includes a transparent material configured to transmit the light irradiated from the lamp heater.
8 . The apparatus of claim 7 , wherein the plurality of light absorbing patterns include an absorbing material, the absorbing material configured to absorb incident light that is irradiated from the lamp heater and has passed through the transparent plate, the absorbing material configured to exhibit a photothermal effect, and
wherein the light reflecting pattern includes a reflective material, the reflective material configured to reflect incident light that is irradiated from the lamp heater.
9 . An apparatus for soldering electronic devices, the apparatus comprising:
a base plate configured to support a package substrate, wherein a plurality of semiconductor chips are on the package substrate in a plurality of rows and a plurality of columns;
a lamp heater configured to irradiate light to the plurality of semiconductor chips in a vertical direction, to mount the plurality of semiconductor chips on the package substrate;
a pressurization mask including a transparent plate between the base plate and the lamp heater, wherein the transparent plate includes
a first surface facing the base plate and a second surface opposite to the first surface, and
a plurality of light absorbing patterns on a plurality of transmission regions of the first surface of the transparent plate, wherein the plurality of transmission regions at least partially overlap with corresponding semiconductor chips of the plurality of semiconductor chips in the vertical direction, the second surface of the transparent plate being free of the plurality of light absorbing patterns; and
a mask holder secured to outer portions of the transparent plate, the mask holder configured to move the pressurization mask in the vertical direction to apply pressure to the plurality of semiconductor chips by contacting the plurality of light absorbing patterns with the plurality of semiconductor chips.
10 . The apparatus of claim 9 , wherein
the transparent plate includes a reflection region that is not overlapped with the plurality of transmission regions in the vertical direction, the reflection region on at least one of the first surface or the second surface, and
the pressurization mask includes a light reflecting pattern on the reflection region.
11 . The apparatus of claim 10 , wherein the light reflecting pattern includes a reflective material, the reflective material configured to reflect incident light that is irradiated from the lamp heater.
12 . The apparatus of claim 9 , further comprising:
a supporting member including a mask frame and a plurality of horizontal ribs,
wherein the mask frame is configured to support a plurality of outside portions of the transparent plate such that the pressurization mask is parallel with the base plate, and
wherein the plurality of horizontal ribs each extend from the mask frame in at least one of a first direction or a second direction, the second direction perpendicular to the first direction.
13 . The apparatus of claim 9 , wherein
the transparent plate has a first thickness, and each of the light absorbing patterns has a second thickness, and
the second thickness is smaller than the first thickness.
14 . The apparatus of claim 13 , wherein the second thickness is within a range of 10 μm to 100 μm, and the first thickness is within a range of 3 mm to 10 mm.
15 . The apparatus of claim 9 , wherein the transparent plate includes a transparent material, the transparent material configured to transmit the light irradiated from the lamp heater, and
wherein the plurality of light absorbing patterns include an absorbing material, the absorbing material configured to absorb the light that has passed through the transparent plate, the absorbing material configured to exhibit a photothermal effect.
16 . An apparatus for soldering electronic devices, the apparatus comprising:
a base plate configured to support a package substrate, wherein a plurality of semiconductor chips are on the package substrate and a plurality of conductive connection members are on a lower surface of each semiconductor chip of the plurality of semiconductor chips;
a lamp heater configured to irradiate light to the plurality of semiconductor chips in a vertical direction, to mount the plurality of semiconductor chips on the package substrate via separate, respective conductive connection members of the plurality of conductive connection members;
a pressurization mask including a transparent plate between the base plate and the lamp heater, wherein the transparent plate includes
a first surface facing the base plate and a second surface opposite to the first surface, and
a light reflecting pattern on a reflection region of the second surface of the transparent plate, wherein the reflection region is not overlapped with the plurality of conductive connection members in the vertical direction; and
a mask holder secured to outer portions of the transparent plate, the mask holder configured to move the pressurization mask in the vertical direction and press the corresponding semiconductor chips by contacting the pressurization mask with the corresponding semiconductor chips,
wherein the transparent plate includes a plurality of transmission regions overlapped with the plurality of conductive connection members in the vertical direction, the plurality of transmission regions being on the first surface, and
wherein the pressurization mask includes a plurality of light absorbing patterns on the plurality of transmission regions on the first surface, the second surface of the transparent plate being free of the plurality of light absorbing patterns.
17 . The apparatus of claim 16 , wherein
the transparent plate has a first thickness,
the light reflecting pattern has a second thickness, and
the second thickness is smaller than the first thickness.
18 . The apparatus of claim 16 , wherein
the transparent plate includes a transparent material, the transparent material configured to transmit the light irradiated from the lamp heater, and
the light reflecting pattern includes a reflective material, the reflective material configured to reflect incident light that is irradiated from the lamp heater.
19 . The apparatus of claim 16 , further comprising:
a supporting member including a mask frame and a plurality of horizontal ribs,
wherein the mask frame is configured to support a plurality of outside portions of the transparent plate such that the pressurization mask is parallel with the base plate, and
wherein the plurality of horizontal ribs each extend from the mask frame in at least one of a first direction or a second direction, the second direction perpendicular to the first direction.