Patent Assignment
Reel/Frame 069938/0403
Assignment of Assignor's Interest
Recorded: 2025-01-21
Pages: 7
Assignors
DROUIN, DOMINIQUE
Executed: 2024-09-09
EL AMRANI, ABDERRAHIM
Executed: 2024-09-10
PARADIS, ETIENNE
Executed: 2024-09-10
DANOVITCH, DAVID
Executed: 2024-09-10
Assignee
UNIVERSITE DE SHERBROOKE
2500, BOULEVARD DE L'UNIVERSITE, SHERBROOKE, J1K 2R1, CANADA
Covered Property
(1)
Heterogeneous Solder Bump Structure
Application:
18/276,787 →
Publication:
US 2024/0113060
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 21, 2025
From: FORTIN, CLEMENT; OBERSON, VALERIE; TURGEON, MICHEL
To: SOCIETE DE COMMERCIALISATION DES PRODUITS DE LA RECHERCHE APPLIQUEE SOCPRA SCIENCES ET GENIE S.E.C.
Reel/Frame 069938/0396 →
Assignment of Assignor's Interest
Jan 21, 2025
From: UNIVERSITE DE SHERBROOKE
To: SOCIETE DE COMMERCIALISATION DES PRODUITS DE LA RECHERCHE APPLIQUEE SOCPRA SCIENCES ET GENIE S.E.C.
Reel/Frame 069938/0410 →