Patent Assignment
Reel/Frame 069938/0410
Assignment of Assignor's Interest
Recorded: 2025-01-21
Pages: 3
Assignor
UNIVERSITE DE SHERBROOKE
Executed: 2024-12-18
Assignee
SOCIETE DE COMMERCIALISATION DES PRODUITS DE LA RECHERCHE APPLIQUEE SOCPRA SCIENCES ET GENIE S.E.C.
35 RUE RADISSON, SUITE 200, SHERBROOKE, J1L 1E2, CANADA
Covered Property
(1)
Heterogeneous Solder Bump Structure
Application:
18/276,787 →
Publication:
US 2024/0113060
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 21, 2025
From: FORTIN, CLEMENT; OBERSON, VALERIE; TURGEON, MICHEL
To: SOCIETE DE COMMERCIALISATION DES PRODUITS DE LA RECHERCHE APPLIQUEE SOCPRA SCIENCES ET GENIE S.E.C.
Reel/Frame 069938/0396 →
Assignment of Assignor's Interest
Jan 21, 2025
From: DROUIN, DOMINIQUE; EL AMRANI, ABDERRAHIM; PARADIS, ETIENNE; DANOVITCH, DAVID
To: UNIVERSITE DE SHERBROOKE
Reel/Frame 069938/0403 →