IP Library Assignment 070908/0290
Patent Assignment
Reel/Frame 070908/0290

Assignment of Assignor's Interest

Recorded: 2025-04-22 Pages: 15
Assignor
ATI TECHNOLOGIES ULC
Executed: 2024-11-08
Assignee
ONESTA IP, LLC
2 PAUL ROAD, WAYNE, PENNSYLVANIA, 19087
Covered Property (1)
Semiconductor Chip with Reinforcing Through-Silicon-Vias
Patent: 8,338,961 →
Application: 13/456,968 →
Publication: US 2012/0205791
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 18, 2024
From: ADVANCED MICRO DEVICES, INC.
To: ONESTA IP, LLC
Reel/Frame 069381/0951 →
Assignment of Assignor's Interest Apr 22, 2025
From: REFAI-AHMED, GAMAL
To: ATI TECHNOLOGIES ULC
Reel/Frame 070907/0877 →
Assignment of Assignor's Interest Apr 22, 2025
From: SU, MICHAEL Z.; BLACK, BRYAN
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 070908/0083 →