Patent Assignment
Reel/Frame 071211/0983
Assignment of Assignor's Interest
Recorded: 2025-05-23
Pages: 3
Assignor
SU, YI-NIEN
Executed: 2021-03-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Interconnect Structure with Bottom Self-Aligned via Landing