IP Library › Assignment 072001/0645

Patent Assignment

Reel/Frame 072001/0645

Change of Name

Recorded: 2025-07-16 Pages: 4

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Assignor

INVENSAS BONDING TECHNOLOGIES, INC.

Executed: 2022-08-15

Assignee

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.

3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134

Covered Property (1)

Mitigating Surface Damage of Probe Pads in Preparation for Direct Bonding of a Substrate

Patent: 12,417,950 →

Application: 18/600,278 →

Publication: US 2024/0213105

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.

Security Interest May 28, 2025

From: ADEIA INC. (F/K/A XPERI HOLDING CORPORATION); ADEIA HOLDINGS INC.; ADEIA MEDIA HOLDINGS INC.; ADEIA IMAGING LLC

To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT

Reel/Frame 071454/0343 →

Assignment of Assignor's Interest Jul 16, 2025

From: GAO, GUILIAN; MIRKARIMI, LAURA WILLS; FOUNTAIN, GAIUS GILLMAN, JR.

To: INVENSAS BONDING TECHNOLOGIES, INC.

Reel/Frame 071731/0345 →