IP Library › Assignment 072217/0212
Patent Assignment
Reel/Frame 072217/0212

Assignment of Assignor's Interest

Recorded: 2025-09-10 Pages: 15
Assignor
NXP USA, INC.
Executed: 2024-07-31
Assignee
CHIP PACKAGING TECHNOLOGIES, LLC
5830 GRANITE PARKWAY, SUITE #100-216, PLANO, TEXAS, 75024
Covered Properties (2)
Lead Frame for Integrated Circuit Device Having J-Leads and Gull Wing Leads
Application: 15/922,923 →
Lead Frame with Bendable Leads
Application: 16/294,923 →
Publication: US 2019/0287883
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 16, 2018
From: PANG, XINGSHOU; YAO, JINZHONG; BAI, ZHIGANG; LYE, MENG KONG
To: NXP USA, INC.
Reel/Frame 045244/0650 →
Assignment of Assignor's Interest Mar 7, 2019
From: YAO, JINZHONG; BAI, ZHIGANG; PANG, XINGSHOU; LYE, MENG KONG
To: NXP USA, INC.
Reel/Frame 048525/0141 →