Lead frame for integrated circuit device having J-leads and gull wing leads
A lead frame for a packaged integrated circuit (IC) device has alternating first and second leads that protrude from a package body in respective first and second planes, where the second plane is parallel to and below the first plane. The first leads are formed into Gull Wing shaped leads and the second leads are formed into J-shaped leads. Inner lead portions of the first and second leads are maintained in the first plane with a tape. An inner lead portion of each of the second leads includes a deformation area that facilitates maintaining the tape in contact with the inner lead area of the second leads, even when a mold tool presses down on an outer lead side of the second leads to place the outer lead ends of the second leads in the second plane.
1. An article of manufacture, comprising:
a central die receiving area configured for receiving at least one integrated circuit die;
a plurality of first leads surrounding the die receiving area and extending outwardly therefrom;
a plurality of second leads surrounding the die receiving area and extending outwardly therefrom, wherein the plurality of second leads are interleaved with the plurality of first leads;
wherein the pluralities of first and second leads lie in a first plane;
wherein each lead of the pluralities of first and second leads has an inner lead area proximate to and spaced from the die receiving area that is configured for connection to an I/O pad of an integrated circuit die disposed in the die receiving area, and an outer lead area that is distal to the die receiving area that allows for an external connection to the integrated circuit die; and
wherein each of the second leads includes a deformation area disposed in the inner lead area proximate to the outer lead areas, wherein the deformation areas facilitate maintaining the remainder of the inner lead areas in the first plane as a force from a mold tool presses a portion of the outer lead areas proximate to the inner lead areas downwards.
2. The article of manufacture of claim 1 , further comprising a tape placed over a top surface of the inner lead areas of the first and second pluralities of leads that maintains the first and second pluralities of leads in the first plane.
3. The article of manufacture of claim 2 , wherein the deformation area prevents the tape from separating from the inner lead areas of the second leads.
4. The article of manufacture of claim 2 , wherein the die receiving area comprises a die pad located in a second plane that is parallel to and below the first plane.
5. The article of manufacture of claim 4 , further comprising an integrated circuit die having a bottom surface attached to the die pad.
6. The article of manufacture of claim 5 , further comprising a plurality of interconnections that electrically connect bonding pads disposed on a top surface of the integrated circuit die with the inner lead areas of the first and second pluralities of leads.
7. The article of manufacture of claim 6 , wherein the plurality of interconnections comprises bond wires.
8. The article of manufacture of claim 6 , further comprising a mold compound that covers the integrated circuit die, the plurality of interconnections, and the inner lead areas of the pluralities of first and second leads, wherein the mold compound defines a package body.
9. The article of manufacture of claim 8 , wherein the plurality of first leads extend outwardly from the package body in the first plane, and the plurality of second leads extend outwardly from the package body in a third plane that is parallel to and between the first and second planes.
10. The article of manufacture of claim 9 , wherein the plurality of first leads are formed into a Gull Wing shape, and the plurality of second leads are formed into a J-lead shape.
11. The article of manufacture of claim 8 , wherein:
the package body has four sides in a plan view;
each side of the package body has one fourth of the plurality of first leads extending therefrom; and
each side of the package body has one fourth of the plurality of second leads extending therefrom.
12. The article of manufacture of claim 1 , wherein the deformation areas of the second leads comprise a tapered portion extending from one end of the inner lead portion to the outer lead portion.
13. The article of manufacture of claim 12 , wherein the plurality of first and second leads have a first thickness, and the tapered portions that comprise the deformation areas of the second leads have a second thickness that is less than the first thickness.
14. The article of manufacture of claim 13 , wherein the first thickness is about 0.127 mm and the second thickness is about 0.05 mm.
15. The article of manufacture of claim 12 , wherein the plurality of first and second leads have a first width, and the tapered portions that comprise the deformation areas of the second leads have a second width that is less than the first width.
16. The article of manufacture of claim 15 , wherein the first width is about 0.127 mm and the second width is about 0.05 mm.