IP Library › Assignment 072617/0543
Patent Assignment
Reel/Frame 072617/0543

Assignment of Assignor's Interest

Recorded: 2025-10-21 Pages: 10
Assignor
YANG, HUA
Executed: 2022-03-23
Assignee
ROCKLEY PHOTONICS LIMITED
1 ASHLEY ROAD, 3RD FLOOR, ALTRITCHAM, WA142DT, UNITED KINGDOM
Covered Properties (2)
Optoelectronic Device and Method of Manufacture of via-First Metallization Scheme
Application: 19/344,435 →
Publication: US 2026/0039089
Platform Mounted Coplanar Pad Architecture
Application: 19/344,471 →
Publication: US 2026/0031597
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 30, 2025
From: ROCKLEY PHOTONICS LTD.
To: CELESTIAL AI INC.
Reel/Frame 072731/0265 →
Merger Feb 10, 2026
From: CELESTIAL AI INC.
To: SICILY MERGER SUB II, INC.
Reel/Frame 074362/0776 →