IP Library Assignment 072731/0265
Patent Assignment
Reel/Frame 072731/0265

Assignment of Assignor's Interest

Recorded: 2025-10-30 Pages: 7
Assignor
ROCKLEY PHOTONICS LTD.
Executed: 2024-10-02
Assignee
CELESTIAL AI INC.
2962 BUNKER HILL LANE, SUITE 200, SANTA CLARA, CALIFORNIA, 95054
Covered Properties (2)
Optoelectronic Device and Method of Manufacture of via-First Metallization Scheme
Application: 19/344,435 →
Publication: US 2026/0039089
Platform Mounted Coplanar Pad Architecture
Application: 19/344,471 →
Publication: US 2026/0031597
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 21, 2025
From: YANG, HUA
To: ROCKLEY PHOTONICS LIMITED
Reel/Frame 072617/0543 →
Merger Feb 10, 2026
From: CELESTIAL AI INC.
To: SICILY MERGER SUB II, INC.
Reel/Frame 074362/0776 →