IP Library › Assignment 072978/0477
Patent Assignment
Reel/Frame 072978/0477

Assignment of Assignor's Interest

Recorded: 2025-11-20 Pages: 6
Assignor
Assignee
CR RUNAN TECHNOLOGIES (CHONGQING) CO. LTD.
216, BUILDING D, NO.25,XI YONG AVE, SHA PING BA DISTRICT, CHONGQING, 401331, CHINA
Covered Properties (3)
Die and Manufacturing Method Therefor, and Chip Packaging Structure and Manufacturing Method Therefor
Application: 18/020,349 →
Publication: US 2023/0268299
Semiconductor Packaging Method and Semiconductor Packaging Structure
Application: 18/013,656 →
Publication: US 2023/0170318
Semiconductor Encapsulation Method and Semiconductor Encapsulation Structure
Application: 17/764,856 →
Publication: US 2022/0399207
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 23, 2023
From: HUO, YAN; TU, XUFENG
To: SIPLP MICROELECTRONICS (CHONGQING) CO., LTD.
Reel/Frame 062788/0950 →
Assignment of Assignor's Interest Mar 8, 2023
From: YANG, WEIYUAN
To: SIPLP MICROELECTRONICS (CHONGQING) CO., LTD.
Reel/Frame 062919/0942 →
Legal Memorandum Demonstrating Proof of Proprietary Interest by Applicant Under Mpep 409.05 Nov 13, 2025
From: CHEW, JIMMY
To: SIPLP MICROELECTRONICS (CHONGQING) CO., LTD.
Reel/Frame 074022/0954 →