IP Library › Assignment 074022/0954
Patent Assignment
Reel/Frame 074022/0954

Legal Memorandum Demonstrating Proof of Proprietary Interest by Applicant Under Mpep 409.05

Recorded: 2025-11-13 Pages: 34
Assignor
CHEW, JIMMY
Executed: 2025-11-03
Assignee
SIPLP MICROELECTRONICS (CHONGQING) CO., LTD.
BUILDING C, NO. 25 XIYONG ROAD, SHAPINGBA DISTRICT, CHONGQING, 401331, CHINA
Covered Property (1)
Semiconductor Encapsulation Method and Semiconductor Encapsulation Structure
Application: 17/764,856 →
Publication: US 2022/0399207
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 20, 2025
From: SIPLP MICROELECTRONICS (CHONGQING) CO., LTD.
To: CR RUNAN TECHNOLOGIES (CHONGQING) CO. LTD.
Reel/Frame 072978/0477 →