Patent Assignment
Reel/Frame 073238/0638
Assignment of Assignor's Interest
Recorded: 2025-10-23
Pages: 6
Assignors
KATKAR, RAJESH
Executed: 2018-04-17
WANG, LIANG
Executed: 2018-03-16
UZOH, CYPRIAN EMEKA
Executed: 2018-04-17
HUANG, SHAOWU
Executed: 2018-06-21
GAO, GUILIAN
Executed: 2018-04-17
MOHAMMED, ILYAS
Executed: 2018-04-18
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Seal for Microelectronic Assembly
Application:
19/265,784 →
Publication:
US 2025/0343086
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.