Patent Assignment
Reel/Frame 073239/0843
Change of Name
Recorded: 2025-10-23
Pages: 4
Assignor
INVENSAS BONDING TECHNOLOGIES, INC.
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Seal for Microelectronic Assembly
Application:
19/265,784 →
Publication:
US 2025/0343086
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.