Patent Assignment
Reel/Frame 073259/0169
Assignment of Assignor's Interest
Recorded: 2025-12-18
Pages: 3
Assignor
HABA, BELGACEM
Executed: 2024-05-21
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Embedded Cooling Assemblies for Advanced Device Packaging and Methods of Manufacturing the Same
Application:
19/422,226 →