IP Library › Assignment 073700/0229
Patent Assignment
Reel/Frame 073700/0229

Assignment of Assignor's Interest

Recorded: 2026-02-05 Pages: 4
Assignor
KYOCERA CORPORATION
Executed: 2026-01-05
Assignee
HADANO SHINDENGEN CO., LTD.
1204 SOYA, HADANO CITY, KANAGAWA, 257-0031, JAPAN
Covered Properties (5)
Power Semiconductor Module
Application: 17/055,699 →
Publication: US 2021/0210421
Semiconductor Device and Electric Device
Application: 17/253,970 →
Publication: US 2021/0265511
Semiconductor Device and Method for Manufacturing Semiconductor Device
Application: 17/910,046 →
Publication: US 2023/0101385
Semiconductor Device and Method of Manufacturing Semiconductor Device
Application: 17/911,929 →
Publication: US 2023/0137811
Semiconductor Device and Method for Manufacturing Semiconductor Device
Application: 17/920,221 →
Publication: US 2023/0178663
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 16, 2020
From: TOJIMA, TAKASHI; NEMOTO, YASUSHI; MORITA, TSUTOMU; OCHIYA, ATSUSHI
To: KYOCERA CORPORATION
Reel/Frame 054377/0690 →
Assignment of Assignor's Interest Dec 21, 2020
From: SHINGO, KABUTOYA
To: KYOCERA CORPORATION
Reel/Frame 054708/0126 →
Assignment of Assignor's Interest Sep 8, 2022
From: KABUTOYA, SHINGO
To: KYOCERA CORPORATION
Reel/Frame 061023/0222 →
Assignment of Assignor's Interest Sep 16, 2022
From: KABUTOYA, SHINGO
To: KYOCERA CORPORATION
Reel/Frame 061115/0614 →
Assignment of Assignor's Interest Oct 20, 2022
From: KABUTOYA, SHINGO
To: KYOCERA CORPORATION
Reel/Frame 061485/0993 →