Patent Assignment
Reel/Frame 073833/0156
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2025-12-04
Received: 2025-12-04
Pages: 33
Assignor
STATS CHIPPAC PTE. LTD.
Executed: 2025-07-10
Assignee
STATS CHIPPAC MANAGEMENT PTE. LTD.
509 YISHUN INDUSTRIAL PARK A, SINGAPORE, SGX, 768735, SINGAPORE
Covered Applications
(8)
ENCODER AND SENSOR SYSTEM HAVING PLURAL SENSORS AND ENCODER ELEMENTS FOR DETERMINING RELATIVE POSITIONS
App. No. 14/625,318
→
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
App. No. 13/177,749
→
Semiconductor Device and Method of Forming Flipchip Interconnection Structure with Bump on Partial Pad
App. No. 12/969,451
→
METHOD OF FORMING PARTIALLY-ETCHED CONDUCTIVE LAYER RECESSED WITHIN SUBSTRATE FOR BONDING TO SEMICONDUCTOR DIE
App. No. 12/951,399
→
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Face-to-Face WLCSP
App. No. 12/786,008
→
SYSTEMS AND METHODS FOR MANAGING CONNECTIONS TO PROCESS DATA
App. No. 12/692,467
→
Method of Forming Protective Material Between Semiconductor Die Stacked on Semiconductor Wafer to Reduce Defects During Singulation
App. No. 12/617,877
→
PACKAGE-ON-PACKAGE SYSTEM WITH HEAT SPREADER
App. No. 12/131,038
→