IP Library › Assignment 074529/0349
Patent Assignment
Reel/Frame 074529/0349

Change of Name

Recorded: 2026-01-23 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
A Bonded Structure Including a First Microelectronic Device Direct Hybrid Bonded to a Second Microelectronic Device
Application: 18/069,485 →
Publication: US 2023/0118156
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Assignment of Assignor's Interest Jan 23, 2026
From: GAO, GUILIAN; FOUNTAIN, GAIUS GILLMAN, JR.; MIRKARIMI, LAURA WILLS; KATKAR, RAJESH
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 074529/0329 →