Assignment of Assignor's Interest

Recorded: 2026-06-09 Pages: 3

Assignors

SHEN, HONG

Executed: 2016-05-10

WANG, LIANG

Executed: 2016-05-10

GAO, GUILIAN

Executed: 2016-05-10

Assignee

INVENSAS CORPORATION

3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134

Covered Properties (2)

System and Method for Providing 3D Wafer Assembly with Known-Good-Dies

Application: 19/699,518 →

System and Method for Providing 3D Wafer Assembly with Known-Good-Dies

Patent: 50,965 →

Application: 18/242,827 →