Semiconductor device and method for manufacturing thereof
View Patent ↗A semiconductor device has a first semiconductor chip 10 molded with a resin 12 , a first metal 14 provided in the resin 12 in a circumference of the first semiconductor chip 10 , and being exposed on a lower surface of the resin 12 , a second metal 16 provided in the resin 12 over the first metal 14 , and being exposed on an upper surface of the resin 12 , and a first wire 18 coupling the first semiconductor chip 10 to the first metal 14 and the second metal 16 . The first wire 18 is coupled to the first metal 14 and the second metal 16 so as to be sandwiched therebetween.
1. A method for manufacturing a semiconductor device comprising:
forming a plurality of first metals on a first support;
mounting a plurality of first semiconductor chips on the first support so as to be adjacent to some of the plurality of first metals;
coupling adjacent first semiconductor chip among the plurality of first semiconductor chips to each other with a first wire over the first metals;
forming a plurality of second metals on a second support;
joining the first support and the second support by respectively coupling the plurality of first metals and the plurality of second metals to each other so as to sandwich the first wire;
forming a resin that molds the plurality of first semiconductor chips by filling an area between the first support and the second support with a resin;
peeling off the first support and the second support from the resin; and
cutting the resin so as to include the first semiconductor chip.
2. The method for manufacturing a semiconductor device according to claim 1 , wherein
the forming of the plurality of first metals is forming the plurality of first metals by pressing the first metals into a plurality of recesses provided on the first support; and
the forming of the plurality of second metals is forming the plurality of second metals by pressing the second metals into a plurality of recesses provided on the second support.
3. The method for manufacturing a semiconductor device according to claim 1 , further comprising:
planarizing a top part of the plurality of first metals prior to the coupling of the adjacent first semiconductor chips to each other with the first wire over the first metals; and
planarizing a top part of the plurality of second metals prior to the joining of the first support and the second support.
4. The method for manufacturing a semiconductor device according to claim 1 , wherein
the forming of the plurality of first metals is forming the plurality of first metals on the first support so as to sandwich the first film; and
the forming of the plurality of second metals is forming the plurality of second metals on the second support so as to sandwich the second film.
5. The method for manufacturing a semiconductor device according to claim 1 , wherein
the first support includes a first through-hole which runs through the first support;
the second support includes a second through-hole which runs through the second support; and
the peeling off of the first support and the second support from the resin is peeling off the first support and the second support from the resin by pumping in air through the first through-hole and the second through-hole.
6. The method for manufacturing a semiconductor device according to claim 1 , further comprising:
forming a first conductor in a circumference of the first support; and
coupling the first semiconductor chip adjacent to the first conductor to the first conductor with the first wire over the first metals.
7. The method for manufacturing a semiconductor device according to claim 1 , further comprising:
forming a second conductor in between the adjacent first semiconductor chips; wherein the coupling of the adjacent first semiconductor chips to each other with the first wire over the first metals comprises:
coupling the adjacent first semiconductor chips to each other with the first wire over the first metals via the second conductor.
8. The method for manufacturing a semiconductor device according to claim 1 , further comprising:
mounting a plurality of second semiconductor chips respectively on the plurality of first semiconductor chips; and
coupling adjacent second semiconductor chips to each other with a second wire over the first metals; wherein the joining of the first support and the second support is joining the first support and the second support by coupling the plurality of first metals and the plurality of second metals so as to sandwich the first wire and the second wire respectively.