Integrated circuit package with molded cavity
View Patent ↗An integrated circuit package system includes a base substrate, attaching a base die over the base substrate, attaching an integrated interposer having interposer circuit devices, over the base die, and forming a package system encapsulant having an encapsulant cavity over the integrated interposer on a side opposite the base die.
1. An integrated circuit package system comprising:
providing a base substrate;
attaching a base die over the base substrate;
attaching an integrated interposer having interposer circuit devices, over the base die;
connecting the base die electrically by a base package connector to the integrated interposer on the same side as the base die;
forming a package system encapsulant having an encapsulant cavity exposing at least a portion of the integrated interposer on a side opposite the base die.
2. The system as claimed in claim 1 further comprising attaching a top package over the integrated interposer.
3. The system as claimed in claim 1 further comprising attaching a top package having an underfill.
4. The system as claimed in claim 1 wherein attaching integrated interposer includes electrically connecting base substrate connectors between the base die and the integrated interposer.
5. The system as claimed in claim 1 wherein attaching the base die includes attaching a base package having the base die, over the base substrate.
6. An integrated circuit package system comprising:
providing a base substrate having base inner connections and base outer connections;
mounting a base die over the base inner connections;
mounting an integrated interposer having interposer circuit devices, interposer inner connections, and interposer outer connections, over the base die;
connecting the base die electrically by a base package connector to the integrated interposer on the same side as the base die;
molding a package system encapsulant having an encapsulant cavity exposing at least a portion of the interposer outer connections on a side opposite the base die; and
mounting a top package over the interposer outer connections on the side opposite the base die.
7. The system as claimed in claim 6 wherein mounting the base die includes pre-mounting the base die over the interposer inner connections.
8. The system as claimed in claim 6 wherein mounting the base die includes mounting a flip chip die over the interposer inner connections.
9. The system as claimed in claim 6 wherein mounting the integrated interposer includes mounting the integrated interposer having an offset from the base die.
10. The system as claimed in claim 6 wherein mounting the integrated interposer includes forming the integrated interposer having rectangular planar dimensions, openings, or a combination thereof.
11. The system as claimed in claim 6 wherein mounting the integrated interposer includes mounting base packages including the base die, and the top package over the integrated interposer.
12. The system as claimed in claim 6 wherein mounting the integrated interposer includes mounting a multi chip module having base packages including the base die.