IP Library Granted Patent US 6,886,989
Granted Patent B2
US 6,886,989 · App. 09/738,686 · Granted May 3, 2005

Alignment of fiber optic bundle to array waveguide using pins

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Quick Facts
Patent No.
US 6,886,989
App. No.
09/738,686
Granted
May 3, 2005
Kind
B2
Abstract

A device and method for aligning a fiber optic bundle with an array waveguide uses pins that partially extend into both the fiber optic bundle and the array waveguide to achieve course alignment. In one embodiment, the pins are inserted into holes formed by V-grooves in the fiber optic bundle. Finely aligning the fiber optic bundle and the array waveguide may be done by manual adjustment.

Claims (38)

1. A method of aligning a fiber optic bundle with an array waveguide comprising:

inserting pins into holes formed in both the fiber optic bundle and the array waveguide, wherein the holes fanned in the fiber optic bundle are farmed by placing two etched substrates together;

pressing the fiber optic bundle and the array waveguide together so that the pins extend into bath the fiber optic bundle and the array waveguide; and

finely aligning optical fibers in the fiber optic bundle with channels of the array waveguide; and

permanently bonding the fiber optic bundle to the array waveguide.

2. The method of claim 1 , wherein permanently bonding the fiber optic bundle to the array waveguide further comprises:

applying an epoxy to bond the fiber optic bundle to the array waveguide.

3. The method of claim 2 further comprising:

dispensing an optical gel between the fiber optic bundle and the array waveguide.

4. The method of claim 3 , wherein the optical gel has an index of refraction substantially similar to channels in the array waveguide.

5. The method of claim 4 further comprising:

curing the epoxy while maintaining alignment between the optical fibers and the channels of the array waveguide.

6. A method of aligning a fiber optic bundle with an array waveguide comprising:

coarsely aligning the fiber optic bundle with the array waveguide by inserting pins into holes formed in an end of the fiber optic bundle,

wherein the holes formed in the fiber optic bundle are formed by placing two etched substrates together,

inserting opposite ends of the pins into the array waveguide, and

pressing the fiber optic bundle and the array waveguide together; and

finely aligning the fiber optic bundle with the array waveguide by adjusting the fiber optic bundle and the array waveguide to improve photonic coupling between optical fibers of the fiber optic bundle and channels of the array waveguide; and

permanently bonding the fiber optic bundle to the array waveguide.

7. The method of claim 6 , wherein permanently bonding the fiber optic bundle to the array waveguide further comprises:

dispensing an epoxy between the fiber optic bundle and the array waveguide.

8. The method of claim 7 , wherein the dispensing the epoxy is performed by dispensing an epoxy having an index of refraction substantially similar to the channels of the array waveguide.

9. The method of claim 1 , wherein the two etched substrates are placed together to form multiple holes, and the multiple holes, and the multiple holes are filled by optical fibers except for the holes with the pins inserted in them.

10. The method of claim, 6 , wherein the two etched substrates are placed together to form multiple holes, and the multiple holes are filled by optical fibers except for the holes with the pins inserted in them.

11. A method comprising:

aligning a fiber optic bundle and an array waveguide by inserting one or more selected from pins, dowels, and rods into one or more holes in the fiber optic bundle and the array waveguide and pressing the fiber optic bundle and the array waveguide together;

finely aligning optical fibers in the fiber optic bundle with channels of the array waveguide; and

permanently bonding the fiber optic bundle to the array waveguide.

12. The method of claim 11 , wherein said bonding comprises bonding with an epoxy.

13. The method of claim 11 , wherein said finely aligning comprises manual adjustment.

14. The method of claim 11 , wherein said finely aligning comprises adjusting the fiber optic bundle and the array waveguide to improve photonic coupling between optical fibers of the fiber optic bundle and channels of the array waveguide.

15. A method comprising:

coarsely aligning a fiber optic bundle and an arrary waveguide using one or more selected from pins, dowels, and rods;

finely aligning optical fibers in the fiber optic bundle with channels of the array waveguide; and

permanently bonding the fiber optic bundle to the array waveguide.

16. The method of claim 15 , wherein said finely aligning comprises manual adjustment.

17. The method of claim 15 , wherein said finely aligning comprises adjusting the fiber optic bundle and the array waveguide to improve photonic coupling between optical fibers of the fiber optic bundle and channels of the array waveguide.

18. The method of claim 15 , wherein said bonding comprises bonding with an epoxy.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 4, 2013
From: INTEL CORPORATION
To: MICRON TECHNOLOGY, INC.
Reel/Frame 030747/0001 →