IP Library › Patent Application 09760439
Patent Application Utility
App. No. 09/760,439 · Confirmation No. 2873

METHOD OF FABRICATING A FLIP-CHIP BALL-GRID-ARRAY PACKAGE WITHOUT CAUSING MOLD FLASH

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2011-10-07 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2011-10-07 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2011-09-30 PA.. Power of Attorney 1 View
2011-09-30 N417 Electronic Filing System Acknowledgment Receipt 2 View
2011-09-30 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2006-08-04 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2001-01-13 TRNA Transmittal of New Application 10 View
2001-01-13 SPEC Specification 9 View
2001-01-13 CLM Claims 2 View
2001-01-13 ABST Abstract 1 View
2001-01-13 DRW Drawings-only black and white line drawings 7 View
2001-01-13 OATH Oath or Declaration filed 2 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
09/760,439
Filed
2001-01-13
Granted
2004-08-10
Pub. No.
US20020092162A1
Art Unit
3729
PTA
-762 days