Patent Assignment
Reel/Frame 011463/0925
Assignment of Assignor's Interest
Recorded: 2001-01-13
Pages: 2
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD TANTZU, TAICHUNG, R.O.C, TAIWAN
Covered Property
(1)
Method of Fabricating a Flip-Chip Ball-Grid-Array Package Without Causing Mold Flash
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.