IP Library Granted Patent US 6,552,408
Granted Patent Utility
US 6,552,408 · Confirmation No. 8806

METHODS, APPARATUSES, AND SUBSTRATE ASSEMBLY STRUCTURES FOR FABRICATING MICROELECTRONIC COMPONENTS USING MECHANICAL AND CHEMICAL-MECHANICAL PLANARIZATION PROCESSES

⬇ PDF
Code Description Pages PDF
2001-02-20 TRNA Transmittal of New Application 3 View
2001-02-20 ADS Application Data Sheet 2 View
2001-02-20 A.PE Preliminary Amendment 2 View
2001-02-20 SPEC Specification 16 View
2001-02-20 CLM Claims 17 View
2001-02-20 ABST Abstract 1 View
2001-02-20 DRW Drawings-only black and white line drawings 7 View
2001-02-20 OATH Oath or Declaration filed 10 View
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Quick Facts
Patent No.
US 6,552,408
App. No.
09/789,352
Filed
2001-02-20
Granted
2003-04-22
Pub. No.
US20010010972A1
Examiner
TRAN, BINH X
Art Unit
1765
PTA
-120 days