IP Library › Granted Patent US 6,645,865
Granted Patent Utility
US 6,645,865 · Confirmation No. 2487

METHODS, APPARATUSES AND SUBSTRATE ASSEMBLY STRUCTURES FOR FABRICATING MICROELECTRONIC COMPONENTS USING MECHANICAL AND CHEMICAL-MECHANICAL PLANARIZATION PROCESSES

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2005-01-27 COCOUT Certificate of Correction - Post Issue Communication 1 View
2003-09-05 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-10-30 TRNA Transmittal of New Application 4 View
2002-10-30 ADS Application Data Sheet 2 View
2002-10-30 A.PE Preliminary Amendment 4 View
2002-10-30 SPEC Specification 16 View
2002-10-30 CLM Claims 17 View
2002-10-30 ABST Abstract 1 View
2002-10-30 DRW Drawings-only black and white line drawings 7 View
2002-10-30 OATH Oath or Declaration filed 10 View
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Quick Facts
Patent No.
US 6,645,865
App. No.
10/285,134
Filed
2002-10-30
Granted
2003-11-11
Pub. No.
US20030054651A1
Examiner
TRAN, BINH X
Art Unit
1765
PTA
-3 days