IP Library Granted Patent US 6,518,181
Granted Patent Utility
US 6,518,181 · Confirmation No. 8243

CONDUCTIVE MATERIAL FOR INTEGRATED CIRCUIT FABRICATION

Inventor: Yungjun Jeff Hu
⬇ PDF
Code Description Pages PDF
2005-12-08 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2001-03-23 TRNA Transmittal of New Application 3 View
2001-03-23 SPEC Specification 13 View
2001-03-23 CLM Claims 1 View
2001-03-23 ABST Abstract 1 View
2001-03-23 DRW Drawings-only black and white line drawings 5 View
2001-03-23 OATH Oath or Declaration filed 1 View
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Quick Facts
Patent No.
US 6,518,181
App. No.
09/815,949
Filed
2001-03-23
Granted
2003-02-11
Pub. No.
US20010042868A1
Examiner
LE, DUNG ANH
Art Unit
2818
PTA
-155 days