IP Library › Assignment 040257/0570
Patent Assignment
Reel/Frame 040257/0570

Assignment of Assignor's Interest

Recorded: 2016-11-08 Pages: 3
Assignor
HU, YONGJUN JEFF
Executed: 1999-03-31
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83707
Covered Properties (6)
Conductive Material for Integrated Circuit Fabrication
Patent: 6,518,181 →
Application: 09/815,949 →
Publication: US 2001/0042868
Conductive Material for Integrated Circuit Fabrication
Patent: 6,646,456 →
Application: 09/815,964 →
Publication: US 2001/0030552
Conductive Material for Integrated Circuit Fabrication
Patent: 6,781,365 →
Application: 10/428,434 →
Publication: US 2003/0183949
Conductive Material for Integrated Circuit Fabrication
Patent: 6,765,398 →
Application: 10/428,703 →
Publication: US 2003/0183521
Conductive Material for Integrated Circuit Fabrication
Patent: 6,870,380 →
Application: 10/428,968 →
Publication: US 2003/0206035
Conductive Material for Integrated Circuit Fabrication
Patent: 7,046,029 →
Application: 11/108,603 →
Publication: US 2005/0225340
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 10, 2016
From: MICRON TECHNOLOGY, INC.
To: APTINA IMAGING CORPORATION
Reel/Frame 040275/0970 →