IP Library Granted Patent US 6,646,456
Granted Patent Utility
US 6,646,456 · Confirmation No. 6462

CONDUCTIVE MATERIAL FOR INTEGRATED CIRCUIT FABRICATION

Inventor: Yungjun Jeff Hu
⬇ PDF
Code Description Pages PDF
2003-08-01 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-08-01 LET. Miscellaneous Incoming Letter 1 View
2001-03-23 TRNA Transmittal of New Application 3 View
2001-03-23 SPEC Specification 13 View
2001-03-23 CLM Claims 1 View
2001-03-23 ABST Abstract 1 View
2001-03-23 DRW Drawings-only black and white line drawings 5 View
2001-03-23 OATH Oath or Declaration filed 1 View
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Quick Facts
Patent No.
US 6,646,456
App. No.
09/815,964
Filed
2001-03-23
Granted
2003-11-11
Pub. No.
US20010030552A1
Art Unit
2829
PTA
-7 days