IP Library Granted Patent US 6,514,424
Granted Patent Utility
US 6,514,424 · Confirmation No. 2327

PROCESS FOR THE DOUBLE-SIDE POLISHING OF SEMICONDUCTOR WAFERS AND CARRIER FOR CARRYING OUT THE PROCESS

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Code Description Pages PDF
2001-04-04 TRNA Transmittal of New Application 2 View
2001-04-04 A.PE Preliminary Amendment 7 View
2001-04-04 SPEC Specification 35 View
2001-04-04 CLM Claims 5 View
2001-04-04 ABST Abstract 1 View
2001-04-04 DRW Drawings-only black and white line drawings 3 View
2001-04-04 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,514,424
App. No.
09/826,135
Filed
2001-04-04
Granted
2003-02-04
Pub. No.
US20010047978A1
Art Unit
1765
PTA
0 days