IP Library › Granted Patent US 6,427,898
Granted Patent Utility Small
US 6,427,898 · Confirmation No. 8721

SOLDER BUMP FORMING METHOD AND APPARATUS

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2013-12-20 IMIS Miscellaneous Internal Document 1 View
2001-04-10 TRNA Transmittal of New Application 5 View
2001-04-10 A.PE Preliminary Amendment 2 View
2001-04-10 SPEC Specification 18 View
2001-04-10 CLM Claims 3 View
2001-04-10 ABST Abstract 1 View
2001-04-10 DRW Drawings-only black and white line drawings 14 View
2001-04-10 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,427,898
App. No.
09/832,073
Filed
2001-04-10
Granted
2002-08-06
Pub. No.
US20010010324A1
Art Unit
1725
PTA
-8 days