IP Library Granted Patent US 6,518,654
Granted Patent Utility
US 6,518,654 · Confirmation No. 4315

PACKAGES FOR SEMICONDUCTOR DIE

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Code Description Pages PDF
2001-04-13 TRNA Transmittal of New Application 2 View
2001-04-13 A.PE Preliminary Amendment 2 View
2001-04-13 SPEC Specification 12 View
2001-04-13 CLM Claims 7 View
2001-04-13 ABST Abstract 1 View
2001-04-13 DRW Drawings-only black and white line drawings 3 View
2001-04-13 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,518,654
App. No.
09/834,415
Filed
2001-04-13
Granted
2003-02-11
Art Unit
2815
PTA
-37 days