IP Library Granted Patent US 6,451,653
Granted Patent Utility
US 6,451,653 · Confirmation No. 2182

MANUFACTURING PROCESS FOR THE INTEGRATION IN A SEMICONDUCTOR CHIP OF AN INTEGRATED CIRCUIT INCLUDING A HIGH-DENSITY INTEGRATED CIRCUIT COMPONENTS PORTION AND A HIGH-PERFORMANCE LOGIC INTEGRATED CIRCUIT COMPONENTS PORTION

Inventor: Alfonso Maurelli
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Code Description Pages PDF
2009-12-09 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2009-12-09 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2009-12-01 PA.. Power of Attorney 1 View
2009-12-01 N417 Electronic Filing System Acknowledgment Receipt 2 View
2001-05-15 TRNA Transmittal of New Application 1 View
2001-05-15 SPEC Specification 10 View
2001-05-15 CLM Claims 4 View
2001-05-15 ABST Abstract 1 View
2001-05-15 DRW Drawings-only black and white line drawings 13 View
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Quick Facts
Patent No.
US 6,451,653
App. No.
09/858,335
Filed
2001-05-15
Granted
2002-09-17
Pub. No.
US20020008222A1
Examiner
HO, TU TU V
Art Unit
2818
PTA
-123 days