IP Library Granted Patent US 6,469,385
Granted Patent Utility
US 6,469,385 · Confirmation No. 7639

INTEGRATED CIRCUIT WITH DIELECTRIC DIFFUSION BARRIER LAYER FORMED BETWEEN INTERCONNECTS AND INTERLAYER DIELECTRIC LAYERS

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Code Description Pages PDF
2001-06-04 TRNA Transmittal of New Application 2 View
2001-06-04 ADS Application Data Sheet 2 View
2001-06-04 SPEC Specification 8 View
2001-06-04 CLM Claims 3 View
2001-06-04 ABST Abstract 1 View
2001-06-04 DRW Drawings-only black and white line drawings 2 View
2001-06-04 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,469,385
App. No.
09/874,175
Filed
2001-06-04
Granted
2002-10-22
Art Unit
2813
PTA
0 days