IP Library › Assignment 044771/0944
Patent Assignment
Reel/Frame 044771/0944

Security Interest

Recorded: 2018-01-30 Pages: 5
Assignor
FULLBRITE CAPITAL PARTNERS, LLC
Executed: 2017-12-28
Assignee
ADVANCED MICRO DEVICES, INC.
2485 AUGUSTINE DRIVE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties (14)
High Speed Bump Plating/Forming
Patent: 6,162,718 →
Application: 09/148,265 →
Stepper Alignment Mark Structure for Maintaining Alignment Integrity
Patent: 6,037,671 →
Application: 09/184,861 →
Method and Apparatus for Fault Detection of a Processing Tool in an Advanced Process Control (Apc) Framework
Patent: 6,546,508 →
Application: 09/430,476 →
Stepper alignment mark structure for maintaining alignment integrity
Patent: 6,239,031 →
Application: 09/487,493 →
Hardmask Trim Process
Patent: 6,420,097 →
Application: 09/562,659 →
Method and Apparatus for the Integration of Sensor Data from a Process Tool in an Advanced Process Control (Apc) Framework
Patent: 6,535,783 →
Application: 09/799,408 →
Integrated Circuit with Dielectric Diffusion Barrier Layer Formed Between Interconnects and Interlayer Dielectric Layers
Patent: 6,469,385 →
Application: 09/874,175 →
Method for Forming an Interconnect Structure Using a Cvd Organic Barc to Mitigate via Poisoning
Patent: 6,632,707 →
Application: 10/058,227 →
Electrochemically Generated Reactants for Chemical Mechanical Planarization
Patent: 6,689,258 →
Application: 10/135,702 →
Method of Manufacturing an Integrated Circuit with Dielectric Diffusion Barrier Layer Formed Between Interconnects and Interlayer Dielectric Layers
Patent: 6,642,145 →
Application: 10/226,520 →
Integrated Circuit with Dielectric Diffusion Barrier Layer Formed Between Interconnects and Interlayer Dielectric Layers
Patent: 6,979,903 →
Application: 10/608,883 →
Integrated Package Circuit with Stiffener
Patent: 8,120,170 →
Application: 12/110,798 →
Publication: US 2008/0197477
Semiconductor Chip with Contoured Solder Structure Opening
Patent: 7,994,044 →
Application: 12/553,336 →
Publication: US 2011/0049725
Integrated Circuit Package Strip with Stiffener
Patent: 8,847,383 →
Application: 13/363,620 →
Publication: US 2012/0127689
Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 4, 1998
From: BOETTCHER, MATHIAS
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 009444/0255 →
Assignment of Assignor's Interest Nov 3, 1998
From: KEPLER, NICK; KARLSSON, OLOV; WANG, LARRY; BANDYOPADHYAY, BASAB
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 009566/0762 →
Assignment of Assignor's Interest Oct 29, 1999
From: SONDERMAN, THOMAS; COSS, JR., ELFIDO; WANG, QINGSU
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 010356/0971 →
Assignment of Assignor's Interest May 2, 2000
From: PIKE, CHRISTOPHER L.; BELL, SCOTT A.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 010743/0621 →
Assignment of Assignor's Interest Mar 5, 2001
From: MILLER, MICHAEL LEE; BUSHMAN, SCOTT
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 011592/0836 →
Assignment of Assignor's Interest Jun 4, 2001
From: AVANZINO, STEVEN C.; WANG, PIN-CHIN CONNIE; NGO, MINH VAN
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 012175/0631 →
Assignment of Assignor's Interest Apr 30, 2002
From: LANSFORD, CHRISTOPHER H.; LANSFORD, JEREMY S.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 012868/0822 →
Assignment of Assignor's Interest May 20, 2002
From: WANG, FEI; OKADA, LYNNE A.; SUBRAMANIAN, RAMKUMAR; KAI, JAMES K.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 012912/0457 →
Assignment of Assignor's Interest Sep 3, 2009
From: TOPACIO, RODEN R.; MCLELLAN, NEIL
To: ATI TECHNOLOGIES ULC
Reel/Frame 023189/0404 →
Change of Name Jan 31, 2018
From: ATI TECHNOLOGIES INC.
To: ATI TECHNOLOGIES ULC
Reel/Frame 045202/0936 →
Assignment of Assignor's Interest Jan 31, 2018
From: MCLELLAN, NEIL R.; CHAN, VINCENT K.; TOPACIO, RODEN R.
To: ATI TECHNOLOGIES INC.
Reel/Frame 044781/0487 →
Assignment of Assignor's Interest Jan 31, 2018
From: KEPLER, NICK; KARLSSON, OLOV; WANG, LARRY; BANDYOPADHYAY, BASAB
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 044782/0351 →
Assignment of Assignor's Interest Jan 31, 2018
From: AVANZINO, STEPHEN C.; WANG, PIN-CHIN CONNIE; NGO, MINH VAN
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 044782/0408 →
Assignment of Assignor's Interest Nov 20, 2019
From: ADVANCED MICRO DEVICES, INC.
To: FULLBRITE CAPITAL PARTNERS LLC
Reel/Frame 051067/0462 →
Assignment of Assignor's Interest Dec 18, 2019
From: FULLBRITE CAPITAL PARTNERS, LLC
To: VANTAGE MICRO LLC
Reel/Frame 051326/0475 →
Assignment of Assignor's Interest Oct 23, 2020
From: FULLBRITE CAPITAL PARTNERS
To: OCEAN SEMICONDUCTOR LLC
Reel/Frame 054148/0640 →
Assignment of Assignor's Interest Dec 22, 2020
From: ADVANCED MICRO DEVICES, INC.
To: FULLBRITE CAPITAL PARTNERS, LLC
Reel/Frame 054723/0523 →
Assignment of Assignor's Interest Dec 22, 2020
From: ATI TECHNOLOGIES ULC
To: FULLBRITE CAPITAL PARTNERS, LLC
Reel/Frame 054723/0367 →
Assignment of Assignor's Interest Mar 30, 2021
From: ADVANCED MICRO DEVICES, INC.
To: FULLBRITE CAPITAL PARTNERS
Reel/Frame 055766/0345 →