IP Library › Assignment 044782/0408
Patent Assignment
Reel/Frame 044782/0408

Assignment of Assignor's Interest

Recorded: 2018-01-31 Pages: 5
Assignors
AVANZINO, STEPHEN C.
Executed: 2001-06-01
WANG, PIN-CHIN CONNIE
Executed: 2001-05-31
NGO, MINH VAN
Executed: 2001-05-31
Assignee
ADVANCED MICRO DEVICES, INC.
ONE AMD PLACE, P.O. BOX 3453, SUNNYVALE, CALIFORNIA, 94088-3453
Covered Properties (2)
Method of Manufacturing an Integrated Circuit with Dielectric Diffusion Barrier Layer Formed Between Interconnects and Interlayer Dielectric Layers
Patent: 6,642,145 →
Application: 10/226,520 →
Integrated Circuit with Dielectric Diffusion Barrier Layer Formed Between Interconnects and Interlayer Dielectric Layers
Patent: 6,979,903 →
Application: 10/608,883 →
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest Jan 30, 2018
From: FULLBRITE CAPITAL PARTNERS, LLC
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 044771/0944 →
Assignment of Assignor's Interest Mar 30, 2021
From: ADVANCED MICRO DEVICES, INC.
To: FULLBRITE CAPITAL PARTNERS
Reel/Frame 055766/0345 →