IP Library › Granted Patent US 6,438,045
Granted Patent Utility
US 6,438,045 · Confirmation No. 6180

REDUNDANCY MAPPING IN A MULTICHIP SEMICONDUCTOR PACKAGE

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Code Description Pages PDF
2007-10-23 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2001-06-12 TRNA Transmittal of New Application 1 View
2001-06-12 A.PE Preliminary Amendment 1 View
2001-06-12 SPEC Specification 14 View
2001-06-12 CLM Claims 4 View
2001-06-12 ABST Abstract 1 View
2001-06-12 DRW Drawings-only black and white line drawings 7 View
2001-06-12 OATH Oath or Declaration filed 7 View
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Quick Facts
Patent No.
US 6,438,045
App. No.
09/879,426
Filed
2001-06-12
Granted
2002-08-20
Pub. No.
US20020027813A1
Examiner
HOANG, HUAN
Art Unit
2818
PTA
-67 days