IP Library › Granted Patent US 6,686,642
Granted Patent Utility
US 6,686,642 · Confirmation No. 4965

MULTI-LEVEL INTEGRATED CIRCUIT FOR WIDE-GAP SUBSTRATE BONDING

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2007-10-02 SRNT Examiner's search strategy and results 2 View
2003-12-08 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-02-07 TRNA Transmittal of New Application 1 View
2002-02-07 DRW Drawings-only black and white line drawings 8 View
2001-06-11 TRNA Transmittal of New Application 1 View
2001-06-11 SPEC Specification 15 View
2001-06-11 CLM Claims 8 View
2001-06-11 ABST Abstract 1 View
2001-06-11 DRW Drawings-only black and white line drawings 8 View
2001-06-11 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,686,642
App. No.
09/879,876
Filed
2001-06-11
Granted
2004-02-03
Pub. No.
US20020185737A1
Art Unit
2811
PTA
-131 days