IP Library › Assignment 021794/0331
Patent Assignment
Reel/Frame 021794/0331

Assignment of Assignor's Interest

Recorded: 2008-11-06 Received: 2008-11-06 Pages: 8
Assignors
HEWLETT-PACKARD COMPANY
Executed: 2008-10-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMTED
8 LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, TWX, 300-77, TAIWAN
Covered Properties (26)
Mems Device and Method of Forming Mems Device
Application: 11/019,780 →
Multiple-Bit Storage Element for Binary Optical Display Element
Application: 10/980,406 →
Microelectromechanical Device with Reset Electrode
Application: 10/817,028 →
Micro-Mirror Device Including Dielectrophoretic Microemulsion
Application: 10/744,832 →
Addressing Circuit for a Cross-Point Memory Array Including Cross-Point Resistive Elements
Application: 10/739,350 →
Micro-Mirrors with Flexure Springs
Application: 10/719,222 →
Mems Device and Method of Forming Mems Device
Application: 10/677,539 →
Mems Device and Method of Forming Mems Device
Application: 10/454,423 →
System and Method for Controlling Movement
Application: 10/441,369 →
Control of Mems and Light Modulator Arrays
Application: 10/429,144 →
Dynamic Self-Refresh Display Memory
Application: 10/423,517 →
Micro-Mirror Device Including Dielectrophoretic Liquid
Application: 10/387,312 →
Dual Memory Cell
Application: 10/371,022 →
Multiple-Bit Storage Element for Binary Optical Display Element
Application: 10/352,703 →
Dielectric Light Device
Application: 10/337,685 →
Low-Energy Writing in Cross-Point Array Memory Devices
Application: 10/289,589 →
Tunneling Emitter with Nanohole Openings
Application: 10/263,055 →
Memory Storage Device with Segmented Column Line Array
Application: 10/177,596 →
Memory Structures
Application: 10/177,239 →
Electrostatic Drive
Application: 10/043,971 →
Methods and Compositions for Enhanced Delivery of Bioactive Molecules
Application: 09/999,820 →
Memory Cell Structure
Application: 10/001,740 →
Memory Controller for Memory Card Manages File Allocation Table
Application: 09/966,271 →
Partial Swing Low Power Cmos Logic Circuits
Application: 09/920,886 →
Multi-Level Integrated Circuit for Wide-Gap Substrate Bonding
Application: 09/879,876 →
Telephone System with Programmable Line Appearances
Application: 09/843,409 →