Patent Application
Utility
App. No. 09/896,945
· Confirmation No. 9974
Process for etching silicon wafers
Abandoned -- Failure to Respond to an Office Action
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-06-29 | TRNA |
Transmittal of New Application | 4 | View | |
| 2001-06-29 | ADS |
Application Data Sheet | 2 | View | |
| 2001-06-29 | SPEC |
Specification | 37 | View | |
| 2001-06-29 | CLM |
Claims | 6 | View | |
| 2001-06-29 | ABST |
Abstract | 1 | View | |
| 2001-06-29 | DRW |
Drawings-only black and white line drawings | 9 | View | |
| 2001-06-29 | OATH |
Oath or Declaration filed | 4 | View | |
| 2001-06-29 | LET. |
Miscellaneous Incoming Letter | 1 | View |
Inventors
Attorneys & Agents of Record
Classification
USPC
438/753
H10P50/613
H10P90/126
H10P50/642
Prosecution
Publication
- Pub. No.
- US20020034881A1
- Pub. Date
- 2002-03-21
MEMC ELECTRONIC MATERIALS, INC. (NOW KNOWN AS SUNEDISON, INC.),
MEMC PASADENA, INC.,
PLASMASIL, L.L.C.,
SIBOND, L.L.C.,
MEMC SOUTHWEST INC.,
MEMC INTERNATIONAL, INC. (NOW KNOWN AS SUNEDISON INTERNATIONAL, INC.)
from
CITICORP USA, INC.
RELEASE OF SECURITY INTEREST TO REEL/FRAME: 012280/0161
Recorded 2014-03-17
from
CITICORP USA, INC.
RELEASE OF SECURITY INTEREST
Recorded 2005-08-11
from
MEMC ELECTRONIC MATERIALS, INC.,
MEMC HOLDINGS CORPORATION,
MEMC INTERNATIONAL, INC.,
MEMC PASADENA, INC.,
MEMC SOUTHWEST INC.,
PLASMASIL, L.L.C.,
SIBOND, L.L.C.
SECURITY AGREEMENT
Recorded 2001-12-28
from
MEMC ELECTRONIC MATERIALS, INC.,
MEMC INTERNATIONAL, INC.,
MEMC PASADENA, INC.,
MEMC SOUTHWEST INC.,
PLASMASIL, L.L.C.,
SIBOND, L.L.C.
SECURITY INTEREST
Recorded 2001-11-21
from
MEMC ELECTRONIC MATERIALS, INC.,
MEMC INTERNATIONAL, INC.,
MEMC PASADENA, INC.,
MEMC SOUTHWEST INC.,
PLASMASIL, L.L.C.,
SIBOND, L.L.C.
SECURITY AGREEMENT
Recorded 2001-11-21
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-09-10
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