IP Library Granted Patent US 6,830,961
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Granted Patent Utility
US 6,830,961 · Confirmation No. 3239

METHODS FOR LEADS UNDER CHIP IN CONVENTIONAL IC PACKAGE

Inventor: David J. Corisis
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Quick Facts
Patent No.
US 6,830,961
App. No.
09/918,739
Filed
2001-07-31
Granted
2004-12-14
Pub. No.
US20010045629A1
Art Unit
2827
PTA
-120 days