IP Library Assignment 040256/0506
Patent Assignment
Reel/Frame 040256/0506

Assignment of Assignor's Interest

Recorded: 2016-11-08 Pages: 4
Assignor
CORISIS, DAVID J.
Executed: 1996-12-19
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83707
Covered Properties (7)
Leads Under Chip in Conventional Ic Package
Patent: 6,271,580 →
Application: 09/301,710 →
Leads Under Chip in Conventional Ic Package
Patent: 6,277,673 →
Application: 09/302,083 →
Leads Under Chip Ic Package
Patent: 6,130,474 →
Application: 09/417,159 →
Leads Under Chip in Conventional Ic Package
Patent: 6,445,061 →
Application: 09/852,868 →
Publication: US 2001/0031553
Methods for Leads Under Chip in Conventional Ic Package
Patent: 6,830,961 →
Application: 09/918,739 →
Publication: US 2001/0045629
Leads Under Chip Ic Package
Patent: 6,958,528 →
Application: 10/300,300 →
Publication: US 2003/0067059
Leads Under Chip Ic Package
Patent: 7,084,490 →
Application: 11/185,346 →
Publication: US 2005/0248006
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 10, 2016
From: MICRON TECHNOLOGY, INC.
To: APTINA IMAGING CORPORATION
Reel/Frame 040275/0970 →