IP Library Granted Patent US 7,317,310
Granted Patent B2
US 7,317,310 · App. 09/954,402 · Granted Jan 8, 2008

Embedded PCB identification

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Quick Facts
Patent No.
US 7,317,310
App. No.
09/954,402
Granted
Jan 8, 2008
Kind
B2
Abstract

A method of tracking a printed circuit board is described. An embedded identification device is utilized. The embedded identification device is placed in a layer of the printed circuit board. An external transceiver is used to communicate with the embedded device and record platform information.

Claims (30)

1. A method of testing a printed circuit board, comprising:

placing an integrated circuit in a layer of the printed circuit board;

communicating testing information to the integrated circuit in the printed circuit board using a radio frequency signal transmitted by a transceiver;

communicating sorting information to the integrated circuit in the printed circuit board using a radio frequency signal transmitted by the transceiver, wherein the sorting information comprises a list of components of the printed circuit board; and

grouping the printed circuit board with other printed circuit boards having like components.

2. The method of claim 1 , wherein testing information is stored in the integrated circuit.

3. The method of claim 1 , wherein the layer of the printed circuit board is a ground layer of the printed circuit board.

4. A method of tracking a printed circuit board, comprising:

placing a programmed integrated circuit in a layer of the printed circuit board;

tracking the printed circuit board during manufacturing with an external transceiver, wherein the printed circuit board is tracked with a radio frequency signal;

communicating sorting information to the integrated circuit in the printed circuit board using a radio frequency signal, wherein the sorting information comprises a list of components of the printed circuit board; and

grouping the printed circuit board with other printed circuit boards having like components.

5. The method of claim 4 , further comprising recording the printed circuit board information using software.

6. The method of claim 4 , wherein the printed circuit board is a four-layer printed circuit board.

7. The method of claim 4 , wherein the integrated circuit is programmed with a part number.

8. The method of claim 4 , wherein the integrated circuit is placed in a northwest corner of the printed circuit board.

9. The method of claim 4 , wherein the integrated circuit is a passive radio frequency device.

10. The method of claim 4 , wherein the integrated circuit is a flash memory.

11. The method of claim 10 , wherein the flash memory is a flash electrically erasable read only memory.

12. The method of claim 4 , wherein the printed circuit board is tracked using a computer laptop transceiver.

13. The method of claim 4 , wherein the printed circuit board is tracked using a cellular phone transceiver.

14. The method of claim 4 , wherein the layer of the printed circuit board is a ground layer of the printed circuit board.

15. An apparatus comprising:

means for storing a printed circuit board identification number in a layer of the printed circuit board;

means for tracking platform information of the printed circuit board from a bare board state to a completed motherboard state;

means for communicating sorting information with an external transceiver, wherein the sorting information comprises a list of components of the printed circuit board; and

means for grouping the printed circuit board with other printed circuit boards having like components.

16. The apparatus of claim 15 further comprising an integrated circuit to record the printed circuit board information.

17. The apparatus of claim 15 further comprising a means for testing the printed circuit board.

18. The apparatus of claim 15 , wherein the layer of the printed circuit board is a ground layer of the printed circuit board.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 4, 2013
From: INTEL CORPORATION
To: MICRON TECHNOLOGY, INC.
Reel/Frame 030747/0001 →